Our silver paste product line is composed of nano/micro particles, enabling high-performance sintering at ≤200 °C. It is suitable for direct-write printing with line widths ≤50 μm across various scenarios; certain formulations achieve printing resolutions down to 1–10 μm. The pastes feature high electrical and thermal conductivity. Customized product development is supported.
Our copper paste product line is composed of nano/micro particles, achieving high-performance sintering at 200 °C – 300 °C. It is suitable for direct-write printing with line widths ≤50 μm across various scenarios; certain formulations enable printing resolutions down to ≤20 μm. Customized product development is supported.
Our dielectric materials product line includes dam glue, encapsulant, underfill, optical UV adhesive, and more. These materials exhibit excellent adhesion to most substrates, such as PET film, ceramics, glass, PI, and PCB boards. They are applicable in displays, electronic components, module assemblies, printed circuit boards, and other fields. Customized product development is supported.